TPSI31P1-Q1
- Replaces large, high power pre-charge resistors using a switched converter architecture
- Improved thermal performance compared to passive pre-charge solutions
- Hysteretic current control for linear charging of downstream capacitance
- Drives external power transistors such as Si, SiC MOSFET, or IGBT
- Integrated isolated secondary supply for gate bias
- 17V gate drive, 1.5A and 2.5A peak source and sink current
- AEC Q-100 qualified for automotive applications:
- Temperature grade 1: –40°C to +125°C, TA
- Functional Safety-Capable
- Safety-related certifications
- Planned: 7070VPK reinforced isolation per DIN EN IEC 60747-17 (VDE 0884-17)
- Planned: 5kVRMS isolation for 1 minute per UL 1577
The TPSI31P1-Q1 is designed to be used in automotive pre-charge systems as an alternative to traditional passive pre-charge architectures that typically include costly electromechanical relays (EMR), along with bulky, high power resistors. The TPSI31P1-Q1, combined with external power switches, power inductor and diode, forms an active pre-charge solution. The inductor current is continuously monitored and controlled in a hysteretic mode of operation by the TPSI31P1-Q1 to linearly charge the large capacitance of the downstream system. The TPSI31P1-Q1 is an isolated switch driver that generates its own secondary bias supply from power received on its primary side, therefore no isolated secondary supply is required. With a gate drive voltage of 17V with 1.5A and 2.5A peak source and sink current, a large availability of power switches can be used including SiC FET and IGBT.
The TPSI31P1-Q1 integrates a communication back-channel that transfers status information from the secondary side to the primary side via open-drain output, PGOOD (Power Good) and indicates when the secondary power is valid.
The TPSI31P1-Q1 reinforced isolation is extremely robust with much higher reliability, lower power consumption, and increased temperature ranges than those found in optocouplers. Replacing the EMR and power resistor with a solid state solution can lead to reduced cost and form factor, while providing higher reliability.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPSI31P1-Q1 Automotive Active Pre-charge Controller With 17V Isolated Gate Driver and Bias Supply datasheet | PDF | HTML | 2024年 10月 16日 |
Certificate | TPSI31PXQ1EVM-400 EU Declaration of Conformity (DoC) | 2024年 11月 14日 | ||
Functional safety information | TPSI31P1-Q1 Functional Safety FIT Rate, FMD, and Pin FMA | PDF | HTML | 2024年 10月 16日 | |
EVM User's guide | TPSI31P1-Q1 Evaluation Module User's Guide | PDF | HTML | 2024年 8月 29日 |
設計與開發
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TPSI31PXQ1EVM — TPSI31Px-Q1 評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
UNKNOWN (DVX) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。