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I2C & I3C level shifters, buffers & hubs

TCA9511A

ACTIVO

Búfer I2C/SMBus bidireccional de 2 bits de 2.3 V a 5.5 V intercambiable en caliente a 400 kHz

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TCA9511A

ACTIVO
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Detalles del producto

Features Buffer, Enable pin, Hot swap Protocols I2C Frequency (max) (MHz) 0.4 VCCA (min) (V) 2.3 VCCA (max) (V) 5.5 VCCB (min) (V) 2.3 VCCB (max) (V) 5.5 Supply restrictions VCC Single Supply Rating Catalog Operating temperature range (°C) -40 to 125
Features Buffer, Enable pin, Hot swap Protocols I2C Frequency (max) (MHz) 0.4 VCCA (min) (V) 2.3 VCCA (max) (V) 5.5 VCCB (min) (V) 2.3 VCCB (max) (V) 5.5 Supply restrictions VCC Single Supply Rating Catalog Operating temperature range (°C) -40 to 125
VSSOP (DGK) 8 14.7 mm² 3 x 4.9
  • Supports bidirectional data transfer of I2C bus signals
  • Operating power-supply voltage range of 2.3 V to 5.5 V
  • TA ambient air temperature range of -40 °C to 125 °C
  • 1-V Precharge on all SDA and SCL lines prevents corruption during live insertion
  • Accommodates standard mode and fast mode I2C devices
  • Supports clock stretching, arbitration and synchronization
  • Powered-off high-impedance I2C pins
  • Supports bidirectional data transfer of I2C bus signals
  • Operating power-supply voltage range of 2.3 V to 5.5 V
  • TA ambient air temperature range of -40 °C to 125 °C
  • 1-V Precharge on all SDA and SCL lines prevents corruption during live insertion
  • Accommodates standard mode and fast mode I2C devices
  • Supports clock stretching, arbitration and synchronization
  • Powered-off high-impedance I2C pins

The TCA9511A is a hot-swappable I2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock lines. Control circuitry prevents the backplane-side I2C lines (in) from being connected to the card-side I2C lines (out) until a stop command or bus idle condition occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitances isolated. During insertion, the SDA and SCL lines are pre-charged to 1 V to minimize the current required to charge the parasitic capacitance of the device.

When the I2C bus is idle, the TCA9511A can be put into shutdown mode by setting the EN pin low, reducing power consumption. When EN is pulled high, the TCA9511A resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.

The TCA9511A is a hot-swappable I2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock lines. Control circuitry prevents the backplane-side I2C lines (in) from being connected to the card-side I2C lines (out) until a stop command or bus idle condition occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitances isolated. During insertion, the SDA and SCL lines are pre-charged to 1 V to minimize the current required to charge the parasitic capacitance of the device.

When the I2C bus is idle, the TCA9511A can be put into shutdown mode by setting the EN pin low, reducing power consumption. When EN is pulled high, the TCA9511A resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.
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Documentación técnica

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* Data sheet TCA9511A Hot Swappable I2C Bus and SMBus Buffer datasheet (Rev. C) PDF | HTML 25 sep 2020
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 03 jul 2024
Application note I2C Solutions for Hot Swap Applications (Rev. A) 31 ene 2023
Certificate TCA9511AEVM EU Declaration of Conformity (DoC) 18 ago 2020
EVM User's guide EVM User's Guide for TCA9511A 04 sep 2019

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TCA9511AEVM — Módulo de evaluación de búfer de bus de dos cables intercambiable en caliente

This EVM provides configurable loading conditions through adjustable pull up resistors and bus capacitance which allows designers to easily test the performance of this device in their system. The EVM can be populated with a socket to test over temperature as well.
Guía del usuario: PDF
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Modelo de simulación

TCA9511A IBIS Model

SCPM046.ZIP (44 KB) - IBIS Model
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Herramienta de diseño

I2C-DESIGNER — Herramienta de diseño I2C

Use the I2C Designer tool to quickly resolve conflicts in addressing, voltage level and frequency in I2C based designs. Enter master and slave inputs to automatically generate an I2C tree or easily build a custom solution. This tool will help designers save time and comply with the I2C standard (...)
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Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VSSOP (DGK) 8 Ultra Librarian
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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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