TPS2HB35-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: TA = –40°C to
125°C ambient operating temperature range - Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Withstands 40-V load dump
- Device temperature grade 1: TA = –40°C to
- Dual-channel smart high-side switch with 35-mΩ RON (TJ = 25°C)
- Improve system level reliability through adjustable current limiting
- Current limit adjustable from 2 A to 25 A
- Robust integrated output protection:
- Integrated thermal protection
- Protection against short to ground/battery
- Protection against reverse battery events including automatic switch on with reverse voltage
- Automatic shut off if loss of battery/ground occurs
- Integrated output clamp to demagnetize inductive loads
- Configurable fault handling
- Analog sense output can be configured to accurately measure:
- Load current
- Device temperature
- Provides fault indication through SNS pin
- Detection of open load and short-to-battery
The TPS2HB35-Q1 device is a dual-channel smart high-side switch intended for use in 12-V automotive systems. The device integrates robust protection and diagnostic features to ensure output port protection even during harmful events like short circuits in automotive systems. The device protects against faults through a reliable current limit, which, depending on device variant, is adjustable from 2 A to 25 A .
The high current limit range allows for usage in loads that require large transient currents, while the low current limit range provides improved protection for loads that do not require high peak current. The device is capable of reliably driving various load profiles.
The TPS2HB35-Q1 also provides a high accuracy analog current sense that allows for improved load diagnostics. By reporting load current and device temperature to a system MCU, the device enables predictive maintenance and load diagnostics that improves the system lifetime.
The TPS2HB35-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.
技術文件
設計與開發
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HSS-MOTHERBOARDEVM — 高壓側開關主機板
TPS2HB35A-Q1 Unencrypted PSpice Transient Model Package (Rev. A)
TPS2HB35B-Q1 Unencrypted PSpice Transient Model Package (Rev. C)
TPS2HB35D-Q1 Unencrypted PSpice Transient Model Package (Rev. A)
TPS2HB35F-Q1 Unencrypted PSpice Transient Model Package (Rev. A)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTSSOP (PWP) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。