計算工具
TPS2HB50-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: TA = –40°C to
125°C ambient operating temperature range - Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Withstands 40-V load dump
- Device temperature grade 1: TA = –40°C to
- Dual-channel smart high-side switch with 50-mΩ RON (TJ = 25°C)
- Improve system level reliability through adjustable current limiting
- Current limit adjustable from 2 A to 18 A
- Robust integrated output protection:
- Integrated thermal protection
- Protection against short to ground/battery
- Protection against reverse battery events including automatic switch on with reverse voltage
- Automatic shut off if loss of battery/ground occurs
- Integrated output clamp to demagnetize inductive loads
- Configurable fault handling
- Analog sense output can be configured to accurately measure:
- Load current
- Device temperature
- Provides fault indication through SNS pin
- Detection of open load and short-to-battery
The TPS2HB50-Q1 device is a dual-channel smart high-side switch intended for use in 12-V automotive systems. The device integrates robust protection and diagnostic features to ensure output port protection even during harmful events like short circuits in automotive systems. The device protects against faults through a reliable current limit, which, depending on device variant, is adjustable from 2 A to 18 A.
The high current limit range allows for usage in loads that require large transient currents, while the low current limit range provides improved protection for loads that do not require high peak current. The device is capable of reliably driving various load profiles.
The TPS2HB50-Q1 also provides a high accuracy analog current sense that allows for improved load diagnostics. By reporting load current and device temperature to a system MCU, the device enables predictive maintenance and load diagnostics that improves the system lifetime.
The TPS2HB50-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.
技術文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 13 設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
開發板
HSS-MOTHERBOARDEVM — 高壓側開關主機板
The HSS-MOTHERBOARDEVM evaluation module is designed to evaluate the <50mΩ Ron devices in TI's high side switch portfolio. These devices include TPS1HA08-Q1, TPS2HB08-Q1, TPS2HB16-Q1, TPS2HB35-Q1, and TPS2HB50-Q1. This board does not come populated with the devices, but allows any of the (...)
模擬型號
TPS2HB50B-Q1 Unencrypted PSpice Transient Model Package (Rev. B)
SLVMCI2B.ZIP (9 KB) - PSpice Model
模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
參考設計
TIDA-00971 — 車用負載短路可靠性和準確的電流感測參考設計
This reference design addresses the design challenges of providing power to the two actuators in a variable displacement A/C compressor. In designing circuits for these two loads, design engineers not only have the challenge of managing different current levels but also have to sense the current (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HTSSOP (PWP) | 16 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。