Inicio Interfaz Circuitos integrados USB Redrivers y multiplexores USB

TS3USB3031

ACTIVO

Interruptor DP3T USB 2.0 de alta velocidad y enlace móvil de alta definición (MHL) (6.5 GHz)

Detalles del producto

Type Passive mux Function USB 2.0 USB speed (MBits) 480 Number of channels 2 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 2.5 Ron (typ) (mΩ) 4500 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Configuration 3:1 Features Current Leakage Protection, Logic Controlled (Output Enabled), Mobile High-Definition Link (MHL), Over-Voltage Tolerance (OVT), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 40 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 6500
Type Passive mux Function USB 2.0 USB speed (MBits) 480 Number of channels 2 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 2.5 Ron (typ) (mΩ) 4500 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Configuration 3:1 Features Current Leakage Protection, Logic Controlled (Output Enabled), Mobile High-Definition Link (MHL), Over-Voltage Tolerance (OVT), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 40 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 6500
WQFN (RMG) 12 3.24 mm² 1.8 x 1.8
  • VCC Range: 2.5 V to 4.3 V
  • Mobile High-definition Link (MHL) or Mobility Display Port (MyDP) Switch:
    • Bandwidth (–3 dB): 6.5 GHz
    • RON (Typical): 5.5 Ω
    • CON (Typical): 1.3 pF
  • USB Switches (2 Sets):
    • Bandwidth (–3 dB): 6.5 GHz
    • RON (Typical): 4.5 Ω
    • CON (Typical): 1 pF
  • Current Consumption: 28 µA (Typical)
  • Special Features:
    • IOFF Protection Prevents Current Leakage in Powered-Down State (VCC = 0 V)
    • 1.8-V Compatible Control Inputs (SEL)
    • Overvoltage Tolerance (OVT) on All I/O Pins up to 5.5 V Without External Components
  • ESD Performance:
    • 2-kV Human-Body Model (A114B, Class II)
    • 1-kV Charged-Device Model (C101)
  • Package:
    • 12-Pin VQFN Package (1.8-mm × 1.8-mm, 0.5-mm Pitch)
  • VCC Range: 2.5 V to 4.3 V
  • Mobile High-definition Link (MHL) or Mobility Display Port (MyDP) Switch:
    • Bandwidth (–3 dB): 6.5 GHz
    • RON (Typical): 5.5 Ω
    • CON (Typical): 1.3 pF
  • USB Switches (2 Sets):
    • Bandwidth (–3 dB): 6.5 GHz
    • RON (Typical): 4.5 Ω
    • CON (Typical): 1 pF
  • Current Consumption: 28 µA (Typical)
  • Special Features:
    • IOFF Protection Prevents Current Leakage in Powered-Down State (VCC = 0 V)
    • 1.8-V Compatible Control Inputs (SEL)
    • Overvoltage Tolerance (OVT) on All I/O Pins up to 5.5 V Without External Components
  • ESD Performance:
    • 2-kV Human-Body Model (A114B, Class II)
    • 1-kV Charged-Device Model (C101)
  • Package:
    • 12-Pin VQFN Package (1.8-mm × 1.8-mm, 0.5-mm Pitch)

The TS3USB3031 device is a 2-channel, 1:3 multiplexer that includes a high-speed Mobile High-Definition Link (MHL), Mobility Display Port (MyDP) switch, and USB 2.0 High-Speed (480 Mbps) switches in the same package. These configurations allow the system designer to save board space and eliminate multiple connectors buy using a common USB or Mico-USB connector for MHL/MyDP signals and two sets of USB data. The MHL/MyDP path supports the latest MHL Rev. 3.0 specification.

The TS3USB3031 has a VCC range of 2.5 V to 4.3 V and supports overvoltage tolerance (OVT) feature, which allows the I/O pins to withstand overvoltage conditions (up to 5.5 V). The power-off protection feature forces all I/O pins to be in high impedance mode when power is not present, allowing full isolation of the signals lines under such condition without excessive leakage current. The select pins of TS3USB3031 are compatible with 1.8-V control voltage, allowing them to be directly interfaced with the General Purpose I/O (GPIO) from a mobile processor with out needing additional voltage level shifting circuitry.

The TS3USB3031 comes with a small 12-pin VQFN package with only 1.8 mm × 1.8 mm in size, which makes it a perfect candidate to be used in mobile applications.

The TS3USB3031 device is a 2-channel, 1:3 multiplexer that includes a high-speed Mobile High-Definition Link (MHL), Mobility Display Port (MyDP) switch, and USB 2.0 High-Speed (480 Mbps) switches in the same package. These configurations allow the system designer to save board space and eliminate multiple connectors buy using a common USB or Mico-USB connector for MHL/MyDP signals and two sets of USB data. The MHL/MyDP path supports the latest MHL Rev. 3.0 specification.

The TS3USB3031 has a VCC range of 2.5 V to 4.3 V and supports overvoltage tolerance (OVT) feature, which allows the I/O pins to withstand overvoltage conditions (up to 5.5 V). The power-off protection feature forces all I/O pins to be in high impedance mode when power is not present, allowing full isolation of the signals lines under such condition without excessive leakage current. The select pins of TS3USB3031 are compatible with 1.8-V control voltage, allowing them to be directly interfaced with the General Purpose I/O (GPIO) from a mobile processor with out needing additional voltage level shifting circuitry.

The TS3USB3031 comes with a small 12-pin VQFN package with only 1.8 mm × 1.8 mm in size, which makes it a perfect candidate to be used in mobile applications.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TS3USB3031 2-Channel, 1:3, USB 2.0 High-Speed (480 Mbps) and Mobile High-Definition Link (MHL) or Mobility Display Port (MyDP) Switch datasheet (Rev. C) PDF | HTML 19 mar 2017
Application note Passive Mux Selection Based On Bandwidth > Ron 11 sep 2019
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 14 jun 2018
Application note TMDS Clock Detection Solution in HDMI Sink Applications 23 ago 2017
EVM User's guide TS3USB3031 EVM User's Guide 23 sep 2013

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

TS3USB3031 HSpice Model

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Pedidos y calidad

Información incluida:
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  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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