Inicio Interfaz Circuitos integrados USB Redrivers y multiplexores USB
Inicio
Interfaz
Circuitos integrados USB
Redrivers y multiplexores USB

TS3USB3200

ACTIVO

Interruptor de enlace de alta definición móvil y de alta velocidad USB 2.0 con selección de ID y con

Haga su pedido ahora
Hoja de datos

TS3USB3200

ACTIVO
Hoja de datos Haga su pedido ahora

Detalles del producto

Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 2.7 Ron (typ) (mΩ) 4600 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Configuration 2:1 SPDT Features Current Leakage Protection, Flexible Power Control, Logic Controlled (Output Enabled), Mobile High-Definition Link (MHL), Over-Voltage Tolerance (OVT), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 70 ESD HBM (typ) (kV) 3.5 Bandwidth (MHz) 5500
Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 2.7 Ron (typ) (mΩ) 4600 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Configuration 2:1 SPDT Features Current Leakage Protection, Flexible Power Control, Logic Controlled (Output Enabled), Mobile High-Definition Link (MHL), Over-Voltage Tolerance (OVT), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 70 ESD HBM (typ) (kV) 3.5 Bandwidth (MHz) 5500
UQFN (RSV) 16 4.68 mm² 2.6 x 1.8
  • VCC Range: 2.7 V to 4.3 V
  • Mobile High-Definition Link (MHL) or Mobility
    Display Port (MyDP) Switch
    • Bandwidth (–3 dB): 5.5 GHz
    • Ron (Typical): 5.7 Ω
    • Con (Typical): 2.5 pF
  • USB Switch
    • Bandwidth (–3 dB): 5.5 GHz
    • Ron (Typical): 4.6 Ω
    • Con (Typical): 2.5 pF
  • Current Consumption: 40 µA Typical
  • Special Features
    • Flexible Power Control: Device Can be
      Powered by VBUS Without VCC or by VCC Alone
    • IOFF Protection Prevents Current Leakage in
      Powered-Down State (VCC and VBUS= 0 V)
    • 1.8-V Compatible Control Inputs (SEL1, SEL2,
      and PSEL)
    • Overvoltage Tolerance (OVT) on All I/O Pins
      up to 5.5 V Without External Components
  • ESD Performance:
    • 3.5-kV Human-Body Model (A114B, Class II)
    • 1-kV Charged Device Model (C101)
  • Package:
    • 16-Pin UQFN Package (2.6 × 1.8 mm, 0.4-mm
      Pitch)
  • VCC Range: 2.7 V to 4.3 V
  • Mobile High-Definition Link (MHL) or Mobility
    Display Port (MyDP) Switch
    • Bandwidth (–3 dB): 5.5 GHz
    • Ron (Typical): 5.7 Ω
    • Con (Typical): 2.5 pF
  • USB Switch
    • Bandwidth (–3 dB): 5.5 GHz
    • Ron (Typical): 4.6 Ω
    • Con (Typical): 2.5 pF
  • Current Consumption: 40 µA Typical
  • Special Features
    • Flexible Power Control: Device Can be
      Powered by VBUS Without VCC or by VCC Alone
    • IOFF Protection Prevents Current Leakage in
      Powered-Down State (VCC and VBUS= 0 V)
    • 1.8-V Compatible Control Inputs (SEL1, SEL2,
      and PSEL)
    • Overvoltage Tolerance (OVT) on All I/O Pins
      up to 5.5 V Without External Components
  • ESD Performance:
    • 3.5-kV Human-Body Model (A114B, Class II)
    • 1-kV Charged Device Model (C101)
  • Package:
    • 16-Pin UQFN Package (2.6 × 1.8 mm, 0.4-mm
      Pitch)

The TS3USB3200 is a differential single-pole, double throw (SPDT) multiplexer that includes a high-speed Mobile High-Definition Link (MHL) or Mobility Display Port (MyDP) switch and a USB 2.0 High-Speed (480 Mbps) switch in the same package. Additionally included is a single-pole, double throw (SPDT) USB/MHL or MyDP ID switch for easy information control. These configurations allow the system designer to use a common USB or Mico-USB connector for both MHL/MyDP video signals and USB data.

The TS3USB3200 has a VCC range of 2.7 V to 4.3 V and also has the option to be powered by VBUS without VCC. The device supports a overvoltage tolerance (OVT) feature which allows the I/O pins to withstand overvoltage conditions (up to 5.5 V). The power-off protection feature forces all I/O pins to be in high impedance mode when power is not present. This allows full isolation of the signals lines without excessive leakage current. The select pins of TS3USB3200 are compatible with 1.8-V control voltage, allowing them to be directly interfaced with the General Purpose I/O (GPIO) from a mobile processor.

The TS3USB3200 comes with a small 16-pin UQFN package (2.6 mm × 1.8 mm in size), which makes it a perfect candidate for mobile applications.

The TS3USB3200 is a differential single-pole, double throw (SPDT) multiplexer that includes a high-speed Mobile High-Definition Link (MHL) or Mobility Display Port (MyDP) switch and a USB 2.0 High-Speed (480 Mbps) switch in the same package. Additionally included is a single-pole, double throw (SPDT) USB/MHL or MyDP ID switch for easy information control. These configurations allow the system designer to use a common USB or Mico-USB connector for both MHL/MyDP video signals and USB data.

The TS3USB3200 has a VCC range of 2.7 V to 4.3 V and also has the option to be powered by VBUS without VCC. The device supports a overvoltage tolerance (OVT) feature which allows the I/O pins to withstand overvoltage conditions (up to 5.5 V). The power-off protection feature forces all I/O pins to be in high impedance mode when power is not present. This allows full isolation of the signals lines without excessive leakage current. The select pins of TS3USB3200 are compatible with 1.8-V control voltage, allowing them to be directly interfaced with the General Purpose I/O (GPIO) from a mobile processor.

The TS3USB3200 comes with a small 16-pin UQFN package (2.6 mm × 1.8 mm in size), which makes it a perfect candidate for mobile applications.
filter Buscar otro/a Redrivers y multiplexores USB
Descargar Ver vídeo con transcripción Video

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 4
Tipo Título Fecha
* Data sheet TS3USB3200 SPDT USB 2.0 High-Speed (480 Mbps) and Mobile High-Definition Link (MHL) or Mobility Display Port (MyDP) Switch With additional SPDT ID Select Switch and Flexible Power Control datasheet (Rev. B) PDF | HTML 11 jul 2016
Application note Passive Mux Selection Based On Bandwidth (Rev. A) PDF | HTML 31 jul 2024
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 14 jun 2018
EVM User's guide TS3USB3200 Evaluation Module User's Guide 29 ago 2013

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

TS3USB3200 IBIS Model

SCDM152.ZIP (7 KB) - IBIS Model
Descargar
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Solicitar
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
View Options
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
UQFN (RSV) 16 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

Ver todos los temas del foro en inglés

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos