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TPS22901

ACTIVO

Interruptor de carga de fugas de 3.6 V, 0.5 A, 78 mΩ y 22 nA

Detalles del producto

Number of channels 1 Vin (min) (V) 1 Vin (max) (V) 3.6 Imax (A) 0.5 Ron (typ) (mΩ) 83 Shutdown current (ISD) (typ) (µA) 0.137 Quiescent current (Iq) (typ) (µA) 0.204 Soft start Fixed Rise Time Current limit type None Features Inrush current control, Quick output discharge Rating Catalog Operating temperature range (°C) -40 to 85 FET Internal Device type Load switches Function Inrush current control
Number of channels 1 Vin (min) (V) 1 Vin (max) (V) 3.6 Imax (A) 0.5 Ron (typ) (mΩ) 83 Shutdown current (ISD) (typ) (µA) 0.137 Quiescent current (Iq) (typ) (µA) 0.204 Soft start Fixed Rise Time Current limit type None Features Inrush current control, Quick output discharge Rating Catalog Operating temperature range (°C) -40 to 85 FET Internal Device type Load switches Function Inrush current control
DSBGA (YFP) 4 1 mm² 1 x 1
  • Integrated P-Channel Load Switch
  • Low Input Voltage: 1 V to 3.6 V
  • ON-Resistance (Typical Values)
    • rON = 78 mΩ at VIN = 3.6 V
    • rON = 93 mΩ at VIN = 2.5 V
    • rON = 109 mΩ at VIN = 1.8 V
    • rON = 146 mΩ at VIN = 1.2 V
  • 500 mA Maximum Continuous Switch Current
  • Quiescent Current: 82 nA at 1.8 V
  • Shutdown Current: 44 nA at 1.8 V
  • Low Control Input Thresholds Enable Use of 1.2-V, 1.8-V, 2.5-V, and 3.3-V Logic
  • Controlled Slew Rate to Avoid Inrush Currents
    • tr = 40 µs at VIN = 1.8 V (TPS22901/2)
    • tr = 220 µs at VIN = 1.8 V (TPS22902B)
  • Quick Output Discharge (TPS22902/2B)
  • ESD Performance Tested Per JESD 22
    • 2000-V Human Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Four-Pin Wafer-Chip-Scale DSBGA Package
    • 0.8-mm × 0.8-mm, 0.4-mm Pitch, 0.5-mm Height (YFP)
  • Integrated P-Channel Load Switch
  • Low Input Voltage: 1 V to 3.6 V
  • ON-Resistance (Typical Values)
    • rON = 78 mΩ at VIN = 3.6 V
    • rON = 93 mΩ at VIN = 2.5 V
    • rON = 109 mΩ at VIN = 1.8 V
    • rON = 146 mΩ at VIN = 1.2 V
  • 500 mA Maximum Continuous Switch Current
  • Quiescent Current: 82 nA at 1.8 V
  • Shutdown Current: 44 nA at 1.8 V
  • Low Control Input Thresholds Enable Use of 1.2-V, 1.8-V, 2.5-V, and 3.3-V Logic
  • Controlled Slew Rate to Avoid Inrush Currents
    • tr = 40 µs at VIN = 1.8 V (TPS22901/2)
    • tr = 220 µs at VIN = 1.8 V (TPS22902B)
  • Quick Output Discharge (TPS22902/2B)
  • ESD Performance Tested Per JESD 22
    • 2000-V Human Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Four-Pin Wafer-Chip-Scale DSBGA Package
    • 0.8-mm × 0.8-mm, 0.4-mm Pitch, 0.5-mm Height (YFP)

The TPS22901, TPS22902, and TPS22902B are small, low ON-resistance (rON) load switches with a controlled turnon. These devices contain a P-channel MOSFET that operates over an input voltage range of 1.0 V to 3.6 V. The switch is controlled by an on/off input (ON), which can interface directly with low-voltage control signals. In the TPS22902 and TPS22902B, an 88-Ω on-chip load resistor is added for output quick discharge when the switch is turned off.

The TPS22901, TPS22902, and TPS22902B are available in a space-saving 4-pin DSBGA (YFP) with 0.4-mm pitch. These devices are characterized for operation over the free-air temperature range of –40°C to 85°C.

The TPS22901, TPS22902, and TPS22902B are small, low ON-resistance (rON) load switches with a controlled turnon. These devices contain a P-channel MOSFET that operates over an input voltage range of 1.0 V to 3.6 V. The switch is controlled by an on/off input (ON), which can interface directly with low-voltage control signals. In the TPS22902 and TPS22902B, an 88-Ω on-chip load resistor is added for output quick discharge when the switch is turned off.

The TPS22901, TPS22902, and TPS22902B are available in a space-saving 4-pin DSBGA (YFP) with 0.4-mm pitch. These devices are characterized for operation over the free-air temperature range of –40°C to 85°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TPS2290x Ultra-Small, Low Input Voltage, Low rON, Load Switch datasheet (Rev. E) 24 sep 2020
Application note Load Switch Thermal Considerations (Rev. A) 11 oct 2018
Application note Basics of Load Switches (Rev. A) 05 sep 2018
Selection guide Power Management Guide 2018 (Rev. R) 25 jun 2018
Application note Selecting a Load Switch to Replace a Discrete Solution 30 abr 2017
Application note Timing of Load Switches 27 abr 2017
Application note Managing Inrush Current (Rev. A) 28 may 2015
User guide TPS22901/02/02B Evaluation Module (Rev. A) 27 mar 2009

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

TPS22901 Unencrypted PSpice Transient Model Package (Rev. A)

SLVM834A.ZIP (37 KB) - PSpice Model
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Diseños de referencia

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The PMP10630 reference design is a complete high density power solution for Xilinx® Kintex® UltraScale™ XCKU040 FPGA. This design uses an optimal combination of SIMPLE SWITCHER® modules and LDOs to provide all the necessary voltage rails in a small solution size of 36 x 43 mm (1.4 (...)
Test report: PDF
Esquema: PDF
Diseños de referencia

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Design guide: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YFP) 4 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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