MSP430FR2310
- Embedded microcontroller
- 16-bit RISC architecture up to 16 MHz
- Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the SVS Specifications)
- Optimized low-power modes (at 3 V)
- Active mode: 126 µA/MHz
- Standby: real-time clock (RTC) counter (LPM3.5 with 32768-Hz crystal): 0.71 µA
- Shutdown (LPM4.5): 32 nA without SVS
- High-performance analog
- Transimpedance amplifier (TIA) (1)
- Current-to-voltage conversion
- Half-rail input
- Low-leakage negative input down to 5 pA, enabled on TSSOP16 package only
- Rail-to-rail output
- Multiple input selections
- Configurable high-power and low-power modes
- 8-channel 10-bit analog-to-digital converter (ADC)
- Internal 1.5-V reference
- Sample-and-hold 200 ksps
- Enhanced comparator (eCOMP)
- Integrated 6-bit digital-to-analog converter (DAC) as reference voltage
- Programmable hysteresis
- Configurable high-power and low-power modes
- Smart analog combo (SAC-L1)
- Supports general-purpose op amp
- Rail-to-rail input and output
- Multiple input selections
- Configurable high-power and low-power modes
- Transimpedance amplifier (TIA) (1)
- Low-power ferroelectric RAM (FRAM)
- Up to 3.75KB of nonvolatile memory
- Built-in error correction code (ECC)
- Configurable write protection
- Unified memory of program, constants, and storage
- 1015 write cycle endurance
- Radiation resistant and nonmagnetic
- Intelligent digital peripherals
- IR modulation logic
- Two 16-bit timers with three capture/compare registers each (Timer_B3)
- One 16-bit counter-only RTC counter
- 16-bit cyclic redundancy checker (CRC)
- Enhanced serial communications
- Enhanced USCI A (eUSCI_A) supports UART, IrDA, and SPI
- Enhanced USCI B (eUSCI_B) supports SPI and I2C with support for remap feature (see Signal Descriptions)
- Clock system (CS)
- On-chip 32-kHz RC oscillator (REFO)
- On-chip 16-MHz digitally controlled oscillator (DCO) with frequency locked loop (FLL)
- ±1% accuracy with on-chip reference at room temperature
- On-chip very low-frequency 10-kHz oscillator (VLO)
- On-chip high-frequency modulation oscillator (MODOSC)
- External 32-kHz crystal oscillator (LFXT)
- External high-frequency crystal oscillator up to 16 MHz (HFXT)
- Programmable MCLK prescalar of 1 to 128
- SMCLK derived from MCLK with programmable prescalar of 1, 2, 4, or 8
- General input/output and pin functionality
- 16 I/Os on 20-pin package
- 12 interrupt pins (8 pins of P1 and 4 pins of P2) can wake MCU from LPMs
- All I/Os are capacitive touch I/Os
- Development tools and software
- LaunchPad™ development kit (MSP‑EXP430FR2311)
- Target development board (MSP‑TS430PW20)
- Family members (also see Device Comparison)
- MSP430FR2311: 3.75KB of program FRAM and 1KB of RAM
- MSP430FR2310: 2KB of program FRAM and 1KB of RAM
- Package options
- 20-pin TSSOP (PW20)
- 16-pin TSSOP (PW16)
- 16-pin VQFN (RGY16)
(1)The transimpedance amplifier was originally given an abbreviation of TRI in descriptive text, pin names, and register names. The abbreviation has changed to TIA in all descriptive text, but pin names and register names still use TRI.
The MSP430FR231x FRAM microcontrollers (MCUs) are part of the MSP430™ MCU value line sensing family. The devices integrate a configurable low-leakage transimpedance amplifier (TIA) and a general purpose operational amplifier. The MCUs feature a powerful 16-bit RISC CPU, 16-bit registers, and a constant generator that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) also allows the device to wake up from low-power modes to active mode typically in less than 10 µs. The feature set of these MCUs are well suited for applications ranging from smoke detectors to portable health and fitness accessories.
The ultra-low-power MSP430FR231x MCU family consists of several devices that feature embedded nonvolatile FRAM and different sets of peripherals targeted for various sensing and measurement applications. The architecture, FRAM, and peripherals, combined with extensive low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a nonvolatile memory technology that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at lower total power consumption.
The MSP430FR231x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP‑EXP430FR2311 LaunchPad™ development kit and the MSP‑TS430PW20 20-pin target development board. TI provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online support through the E2E™ Community Forum.
For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family Users Guide.
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MSP-EXP430FR2311 — MSP430FR2311 LaunchPad™ development kit
The MSP-EXP430FR2311 LaunchPad™ development kit is an easy-to-use microcontroller development board for MSP430FR2000, MSP430FR21xx and MSP430FR23xx MCUs. It contains everything needed to start developing quickly including on-board emulation for programming, debugging and energy measurements. The (...)
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MSP-TS430PW20 — 適用於 20 針腳 MSP430FR2000、MSP430FR21x 和 MSP430FR23x MCU 的目標開發基板
The MSP-TS430PW20 is a standalone zero insertion force (ZIF) socket target board used to program and debug the MSP430 MCU in-system through the JTAG interface or the Spy Bi-Wire (2-wire JTAG) protocol. The development board supports all MSP430FR2000, MSP430FR21xx or MSP430FR23xx MCUs in a 20-pin or (...)
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MSPFRBOOT — MSPFRBOOT
The bootloader (BSL) on MSP430™ microcontrollers (MCUs) lets users communicate with embedded memory in the MSP MCUs during the prototyping phase, final production, and in service. This is done through standard interfaces such as UART, I2C, SPI, and USB. Both the programmable memory (Flash/FRAM) and (...)
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MSP430 微控制器
TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud
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Arm Cortex-M0+ MCU
MSP430 微控制器
Wi-Fi 產品
Arm Cortex-R MCU
Arm 式處理器
C2000 即時微控制器
低耗電 2.4-GHz 產品
Sub-1 GHz 無線 MCU
硬體開發
開發板
CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)
Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.
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parametric-filter 數位訊號處理器 (DSP) -
parametric-filter Arm 式處理器 -
parametric-filter MSP430 微控制器 -
parametric-filter C2000 即時微控制器 -
parametric-filter Arm 式微控制器 -
parametric-filter 訊號調節器 -
parametric-filter mmWave 雷達感測器 -
parametric-filter Wi-Fi 產品 -
parametric-filter Sub-1 GHz 產品 -
parametric-filter 數位電源隔離式控制器
MSP430-ACADEMY — MSP430™ academy
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MSP-GANG-SOFTWARE — MSP-GANG Software
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Arm Cortex-M0+ MCU
MSP430 微控制器
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UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors
UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.
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產品
C2000 即時微控制器
Arm 式處理器
工業 mmWave 雷達感測器
汽車 mmWave 雷達感測器
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Wi-Fi 產品
Arm Cortex-M4 MCU
Arm Cortex-M0+ MCU
Arm Cortex-R MCU
低耗電 2.4-GHz 產品
汽車無線連線產品
Sub-1 GHz 無線 MCU
MSP430FR2311 SAC TINA-TI Reference Design (Rev. C)
CIRCUIT0020 — 轉阻放大器電路
CIRCUIT060001 — 單電源、低壓側、單向電流感測電路
CIRCUIT060002 — 使用 NTC 熱敏電阻電路的溫度感測
CIRCUIT060003 — 使用 PTC 熱敏電阻電路的溫度感測
CIRCUIT060004 — 低雜訊和長距離 PIR 感測器調節器電路
CIRCUIT060005 — 具有離散差分放大器電路的高壓側電流感測
CIRCUIT060006 — 橋接放大器電路
CIRCUIT060007 — 低壓側雙向電流感測電路
CIRCUIT060009 — 半波整流器電路
MSP-3P-SEARCH — MSP 第三方搜尋工具
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TIDM-FRAM-EEPROM — 使用 MSP430 FRAM 微控制器實現 EEPROM 模擬和感測
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
TSSOP (PW) | 20 | Ultra Librarian |
VQFN (RGY) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點