Product details

Protocols Bluetooth 5.2 Low Energy, Thread, Zigbee 3.0 Type Wireless MCU Features 15.4G PHY, Bluetooth LE support, Bluetooth mesh, End device, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), MTD, NCP, Router, Sleepy end device, Zigbee coordinator, Zigbee network processor Peripherals 1 SPI, 1 UART, 12-bit ADC 8-channel, 2 comparators, 8-bit DAC, I2C, I2S Rating Catalog Flash memory (kByte) 352 RAM (kByte) 40 Number of GPIOs 26 Security Cryptographic acceleration, Debug security, Device identity, Software IP protection Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105
Protocols Bluetooth 5.2 Low Energy, Thread, Zigbee 3.0 Type Wireless MCU Features 15.4G PHY, Bluetooth LE support, Bluetooth mesh, End device, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), MTD, NCP, Router, Sleepy end device, Zigbee coordinator, Zigbee network processor Peripherals 1 SPI, 1 UART, 12-bit ADC 8-channel, 2 comparators, 8-bit DAC, I2C, I2S Rating Catalog Flash memory (kByte) 352 RAM (kByte) 40 Number of GPIOs 26 Security Cryptographic acceleration, Debug security, Device identity, Software IP protection Sensitivity (best) (dBm) -104 Operating temperature range (°C) -40 to 105
VQFN (RGZ) 48 49 mm² 7 x 7 VQFN (RKP) 40 25 mm² 5 x 5

Wireless microcontroller

  • Powerful 48-MHz Arm Cortex-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 2.91 mA active mode, CoreMark
    • 61 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 6.4 mA RX
    • 7.1 mA TX at 0 dBm
    • 9.5 mA TX at +5 dBm
    • 22 mA TX at +10 dBm
    • 101 mA TX at +20 dBm (7x7 package)

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Analog Comparator
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • 5-mm × 5-mm RKP VQFN40 (18 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm Cortex-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 2.91 mA active mode, CoreMark
    • 61 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 6.4 mA RX
    • 7.1 mA TX at 0 dBm
    • 9.5 mA TX at +5 dBm
    • 22 mA TX at +10 dBm
    • 101 mA TX at +20 dBm (7x7 package)

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Analog Comparator
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
  • 5-mm × 5-mm RKP VQFN40 (18 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC2651P3 device is a single-protocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651P3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651P3 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651P3 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBm TX at 101 mA (7x7 package). CC2651P3 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651P3 has a low sleep current of 0.8 µA with RTC and 32KB RAM retention.

Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651P3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC2651P3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC2651P3 device is a single-protocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651P3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651P3 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651P3 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBm TX at 101 mA (7x7 package). CC2651P3 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651P3 has a low sleep current of 0.8 µA with RTC and 32KB RAM retention.

Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651P3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC2651P3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

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Technical documentation

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Type Title Date
* Data sheet CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier datasheet PDF | HTML 30 Mar 2022
* Errata CC2651P3 Silicon Errata PDF | HTML 30 Mar 2022
* User guide CC13x1x3, CC26x1x3 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 11 May 2022
Cybersecurity advisory Bluetooth SIG Erratum - Incoming Notification/Indication Tests Upon Reconnection PDF | HTML 28 Aug 2023
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25 Feb 2022
Application note Hardware Migration to CC2651R3 and CC2651P3 PDF | HTML 17 Feb 2022
More literature Hardware Design Review Request Form for SimpleLink 2.4GHz Devices (Rev. A) 02 Dec 2021
Application note RF PCB Simulation Cookbook 09 Jan 2019
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 Feb 2017

Design & development

Please view the Design & development section on a desktop.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

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