Product details

Type Wireless MCU Protocols Bluetooth 5.2 Low Energy Features Advertising extension, Bluetooth mesh, Channel select algorithm, Direction finding, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range) Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Rating Automotive Operating temperature range (°C) -40 to 105
Type Wireless MCU Protocols Bluetooth 5.2 Low Energy Features Advertising extension, Bluetooth mesh, Channel select algorithm, Direction finding, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range) Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Rating Automotive Operating temperature range (°C) -40 to 105
VQFN (RGZ) 48 49 mm² 7 x 7 VQFNP (RTC) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48-MHz Arm Cortex-M4F processor
  • EEMBC CoreMark score: 148
  • 352KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 80KB of ultra-low leakage SRAM with parity for high-reliability operation
  • 2-pin cJTAG and JTAG debugging
  • Supports over-the-air upgrade (OTA)
  • Programmable radio support for Bluetooth® 5.2 Low Energy

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Qualified for automotive application

  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3

Low power consumption

  • MCU consumption:
    • 3.4 mA active mode, CoreMark
    • 71 µA/MHz running CoreMark
    • 0.94 µA standby mode, RTC, 80KB RAM
    • 0.15 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 31.9 µA in 2 MHz mode
    • 808.5 µA in 24 MHz mode
  • Radio consumption
    • 6.9 mA RX
    • 7.0 mA TX at 0 dBm
    • 9.2 mA TX at +5 dBm

Wireless protocol support

High performance radio

  • –105 dBm for Bluetooth 125-kbps (LE coded PHY)
  • –97 dBm for 1-Mbps PHY
  • Output power up to +5 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can route to any of 31 GPIOs
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Two UART, Two SSI, I 2C, I 2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.63-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RTC VQFN48 with wettable flanks (31 GPIOs)
  • 7-mm × 7-mm RGZ VQFN48 with wettable flanks (31 GPIOs)
  • RoHS-compliant packages

Wireless microcontroller

  • Powerful 48-MHz Arm Cortex-M4F processor
  • EEMBC CoreMark score: 148
  • 352KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 80KB of ultra-low leakage SRAM with parity for high-reliability operation
  • 2-pin cJTAG and JTAG debugging
  • Supports over-the-air upgrade (OTA)
  • Programmable radio support for Bluetooth® 5.2 Low Energy

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Qualified for automotive application

  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3

Low power consumption

  • MCU consumption:
    • 3.4 mA active mode, CoreMark
    • 71 µA/MHz running CoreMark
    • 0.94 µA standby mode, RTC, 80KB RAM
    • 0.15 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 31.9 µA in 2 MHz mode
    • 808.5 µA in 24 MHz mode
  • Radio consumption
    • 6.9 mA RX
    • 7.0 mA TX at 0 dBm
    • 9.2 mA TX at +5 dBm

Wireless protocol support

High performance radio

  • –105 dBm for Bluetooth 125-kbps (LE coded PHY)
  • –97 dBm for 1-Mbps PHY
  • Output power up to +5 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 328, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66

MCU peripherals

  • Digital peripherals can route to any of 31 GPIOs
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Two UART, Two SSI, I 2C, I 2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.63-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RTC VQFN48 with wettable flanks (31 GPIOs)
  • 7-mm × 7-mm RGZ VQFN48 with wettable flanks (31 GPIOs)
  • RoHS-compliant packages

The SimpleLink™ CC2642R-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as car access including passive entry passive start (PEPS) and remote keyless entry (RKE), car sharing, piloted parking, cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth ® 5.2 features: LE Coded PHYs (Long Range), LE 2-Mbit PHY (High Speed), Advertising Extensions, Multiple Advertisement Sets, CSA#2, as well as backwards compatibility and support for key features from the Bluetooth ® 5 and earlier Low Energy specifications.
  • Fully-qualified Bluetooth ® 5.2 software protocol stack included with the SimpleLink™ CC13xx and CC26xx Software Development Kit (SDK), which enables Angle of Arrival (AoA).
  • Longer battery life wireless applications with low standby current of 0.94 µA with full RAM retention.
  • AEC-Q100 qualified at the Grade 2 temperature range (–40 °C to +105 °C) and is offered in a 7-mm x 7-mm VQFN package with wettable flanks.
  • Dedicated software controlled radio controller (Arm ® Cortex ®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards, such as real-time localization (RTLS) technologies.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-105 dBm for 125-kbps LE Coded PHY).

The CC2642R-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee ®, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC2642R-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication in applications such as car access including passive entry passive start (PEPS) and remote keyless entry (RKE), car sharing, piloted parking, cable replacement, and smartphone connectivity. The highlighted features of this device include:

  • Support for Bluetooth ® 5.2 features: LE Coded PHYs (Long Range), LE 2-Mbit PHY (High Speed), Advertising Extensions, Multiple Advertisement Sets, CSA#2, as well as backwards compatibility and support for key features from the Bluetooth ® 5 and earlier Low Energy specifications.
  • Fully-qualified Bluetooth ® 5.2 software protocol stack included with the SimpleLink™ CC13xx and CC26xx Software Development Kit (SDK), which enables Angle of Arrival (AoA).
  • Longer battery life wireless applications with low standby current of 0.94 µA with full RAM retention.
  • AEC-Q100 qualified at the Grade 2 temperature range (–40 °C to +105 °C) and is offered in a 7-mm x 7-mm VQFN package with wettable flanks.
  • Dedicated software controlled radio controller (Arm ® Cortex ®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards, such as real-time localization (RTLS) technologies.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-105 dBm for 125-kbps LE Coded PHY).

The CC2642R-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee ®, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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Technical documentation

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Type Title Date
* Data sheet CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU datasheet (Rev. D) PDF | HTML 11 Jul 2023
* Errata CC2642R-Q1 SimpleLink™ Bluetooth® 5 Low Energy Wireless MCU Silicone Revision E (Rev. A) PDF | HTML 29 Jun 2022
* User guide CC13x2, CC26x2 SimpleLink™ Wireless MCU Technical Reference Manual (Rev. F) PDF | HTML 10 Apr 2023
Application note CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 02 May 2024
White paper Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) PDF | HTML 30 Apr 2024
Application note Crystal Oscillator and Crystal Selection for the CC13xx, CC26xx, and CC23xx Family of Wireless MCUs (Rev. K) PDF | HTML 11 Apr 2024
Application note How to Certify Your Bluetooth Product (Rev. K) PDF | HTML 01 Nov 2023
Cybersecurity advisory Bluetooth LE Secure Pairing Peripheral Devices Can Fail Connection With Central PDF | HTML 11 Sep 2023
Cybersecurity advisory Bluetooth SIG Erratum - Incoming Notification/Indication Tests Upon Reconnection PDF | HTML 28 Aug 2023
White paper 유선 통신과 무선 통신 비교 - EV 배터리 관리 (Rev. A) PDF | HTML 15 Jun 2023
Application note Bluetooth® Angle of Arrival (AoA) Antenna Design (Rev. A) PDF | HTML 07 Jun 2023
White paper Wired vs. Wireless Communications In EV Battery Management (Rev. A) PDF | HTML 06 Jun 2023
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25 Feb 2022
Application note Hardware Migration From CC26x0 to CC26x2R (Rev. D) 23 Aug 2021
Application note CC2538/CC26x0/CC26x2 Serial Bootloader Interface (Rev. D) PDF | HTML 19 Aug 2021
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 12 Apr 2021
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 17 Jul 2020
Cybersecurity advisory Variable Time Tag Comparison on SimpleLink™ Devices PDF | HTML 05 Jun 2020
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 May 2020
Technical article Exploring connectivity trends for Bluetooth® Low Energy in the car PDF | HTML 19 Feb 2020
Technical article Three questions to ask about wireless BMS for hybrid and electric vehicles PDF | HTML 18 Feb 2020
Application note Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 28 Jan 2020
Application note Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 27 Jan 2020
White paper Simple and efficient software development with the SimpleLink™ MCU platform (Rev. E) 06 Dec 2019
Application note Running Bluetooth® Low Energy on CC13x2/CC26xx Without a 32 kHz Crystal (Rev. C) PDF | HTML 23 Sep 2019
Technical article Bluetooth® Low Energy shifts gears for car access PDF | HTML 15 Jul 2019
Application note Bluetooth® Low Energy Tree Structure Network PDF | HTML 29 May 2019
Application note Debugging Communication Range (Rev. A) PDF | HTML 23 May 2019
Application note Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs 15 Apr 2019
Application note Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 10 Jan 2019
Application note RF PCB Simulation Cookbook 09 Jan 2019
White paper Migrating your proprietary solution to the SimpleLink™ WMCU 07 Nov 2018
Application note Low-Power ADC Solution for CC13x2 and CC26x2 02 Mar 2018
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller 27 Feb 2018
User guide CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G) PDF | HTML 16 Jan 2018
Technical article Bluetooth® low energy makes automotive systems more automatic PDF | HTML 04 Oct 2017
White paper Bluetooth® low energy and the automotive transformation 25 Sep 2017
White paper IoT provokes change in ultra-low-power MCUs 19 Jul 2017
White paper RTOS Power Management Emerges as a Key for MCU-based IoT Nodes (Rev. A) 11 May 2017
Application note Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 05 Mar 2017
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 Feb 2017
User guide TI-RTOS 2.20 for CC13xx/CC26xx SimpleLink Getting Started Guide (Rev. D) 17 Jun 2016

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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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