DAC7513
- microPOWER OPERATION: 115 µA at 5V
- POWER-ON RESET TO ZERO
- POWER SUPPLY: +2.7V to +5.5V
- ENSURED MONOTONIC BY DESIGN
- SETTLING TIME: 10 µs to 1LSB
- LOW-POWER SERIAL INTERFACE WITH SCHMITT-TRIGGERED INPUTS
- ON-CHIP OUTPUT BUFFER AMPLIFIER, RAIL-TO-RAIL OPERATION
- SYNC\ INTERRUPT FACILITY
- SOT23-8 AND MSOP-8 PACKAGES
- APPLICATIONS
- PROCESS CONTROL
- DATA ACQUISITION SYSTEMS
- CLOSED-LOOP SERVO-CONTROL
- PC PERIPHERALS
- PORTABLE INSTRUMENTATION
- PROGRAMMABLE ATTENUATION
SPI and QSPI are registered trademarks of Motorola.
Microwire is a registered trademark of National Semiconductor.
The DAC7513 is a low-power, single, 12-bit buffered voltage output Digital-to-Analog Connector (DAC).The on-chip precision output amplifier allows rail-to-rail output swing to be achieved. The DAC7513 uses a versatile 3-wire serial interface that operates at clock rates up to 30MHz and is compatible with standard SPI, QSPI, Microwire, and DSP interfaces.
The DAC7513 requires an external reference voltage to set the output range of the DAC, this allows the DAC7513 to be used in a multiplying mode. The DAC7513 incorporates a power-on reset circuit which ensures that the DAC output powers up at 0V and remains there until a valid write takes place to the device. The DAC7513 contains a power-down feature, accessed over the serial interface, that reduces the current consumption of the device to 200nA at 5V.
The low-power consumption of this part in normal operation makes it ideally suited to portable battery-operated equipment. The power consumption is 0.5mW at 5V reducing to 1 µW in power-down mode.
The DAC7513 is available in an SOT23-8 package and an MSOP-8 package.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DAC7513: Low-Power Rail-To-Rail Output 12-Bit Serial Input D/A Converter datasheet (Rev. A) | 2001年 11月 1日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DCN) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。