DAC6551-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
- Device HBM ESD Classification Level 2
- Device CDM ESD Classification Level C4B
- Relative Accuracy:
- DAC8551-Q1 (16-Bit): 4 LSB INL
- DAC6551-Q1 (12-Bit): 0.3 LSB INL
- Ultralow Glitch Impulse: 0.1 nV-s
- Settling Time: 8 µs to ±0.003% FSR
- Power Supply: 3 V to 5.5 V
- Power-On Reset to Zero Scale
- MicroPower Operation: 160 µA at 5 V
- Low-Power Serial Interface With Schmitt-Triggered Inputs
- On-Chip Output Buffer Amplifier With Rail-to-Rail Operation
- Power-Down Capability
- Binary Input
- SYNC Interrupt Facility
- Available in a Tiny VSSOP-8 Package
The DAC8551-Q1 and DAC6551-Q1 are small, low-power, voltage-output, 16- and 12-bit digital-to-analog converters (DACs) qualified for automotive applications. The DACx551-Q1 devices provide good linearity and minimize undesired code-to-code transient voltages. The devices use a versatile 3-wire serial interface that operates at clock rates to 30 MHz and is compatible with standard SPI, QSPI, Microwire, and digital signal-processor (DSP) interfaces.
The DACx551-Q1 devices require an external reference voltage to set the output range. The devices incorporate a power-on-reset circuit that ensures the DAC output powers up at 0 V and remains there until a valid write to the device takes place. The devices contain a power-down feature, accessed over the serial interface, that reduces the current consumption to 800 nA at 5 V.
The DACx551-Q1 devices power consumption is only 800 µW at 5 V, reducing to less than 4 µW in power-down mode. The DACx551-Q1 devices are available in a VSSOP-8 package.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DACx551-Q1 Automotive 16-, 12-Bit, Ultralow-Glitch, Voltage-Output DAC datasheet (Rev. C) | PDF | HTML | 2016年 12月 13日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VSSOP (DGK) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。