REF3430
- Initial accuracy: ±0.05% (maximum)
- Temperature coefficient : 6 ppm/°C (maximum)
- Operating temperature range: −40°C to +125°C
- Output current: ±10 mA
- Low quiescent current: 95 µA (maximum)
- Ultra-low zero load dropout voltage: 100 mV (maximum)
- Wide input voltage: 12 V
- Output 1/f noise (0.1 Hz to 10 Hz): 3.8 µVp-p/V
- Excellent long-term stability 25 ppm/1000 hrs
- Multiple small footprint 6 pin SOT-23 package pinouts: REF34xx and REF34xxT
The REF34xx device is a low temperature drift (6 ppm/°C), low-power, high-precision CMOS voltage reference, featuring ±0.05% initial accuracy, low operating current with power consumption less than 95 µA. This device also offers very low output noise of 3.8 µVp-p /V, which enables its ability to maintain high signal integrity with high-resolution data converters in noise critical systems. With a small SOT-23 package, REF34xx offers enhanced specifications and pin-to-pin replacement for MAX607x, ADR34xx and LT1790 (REF34xxT, no EN pin). The REF34xx family is compatible to most of the ADC and DAC such as ADS1287, DAC8802 and ADS1112.
Stability and system reliability are further improved by the low output-voltage hysteresis of the device and low long-term output voltage drift. Furthermore, the small size and low operating current of the devices (95 µA) benefit portable and battery-powered applications.
REF34xx is specified for the wide temperature range of −40°C to +125°C.
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點