TLV5629
- Eight Voltage Output DACs in One Package
- TLV5610 . . . 12-Bit
- TLV5608 . . . 10-Bit
- TLV5629 . . . 8-Bit
- Programmable Settling Time vs Power
Consumption- 1 µs In Fast Mode
- 3 µs In Slow Mode
- Compatible With TMS320 and SPI Serial Ports
- Monotonic Over Temperature
- Low Power Consumption:
- 18 mW In Slow Mode at 3-V
- 48 mW In Fast Mode at 3-V
- Reference Input Buffers
- Power-Down Mode
- Buffered, High Impedance Reference Inputs
- Data Output for Daisy-Chaining
- APPLICATIONS
- Digital Servo Control Loops
- Digital Offset and Gain Adjustment
- Industrial Process Control
- Machine and Motion Control Devices
- Mass Storage Devices
The TLV5610, TLV5608, and TLV5629 are pin-compatible, eight-channel, 12-/10-/8-bit voltage output DACs each with a flexible serial interface. The serial interface allows glueless interface to TMS320 and SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string containing 4 control and 12 data bits.
Additional features are a power-down mode, an LDAC input for simultaneous update of all eight DAC outputs, and a data output which can be used to cascade multiple devices.
The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to allow the designer to optimize speed vs power dissipation. The buffered, high-impedance reference input can be connected to the supply voltage.
Implemented with a CMOS process, the DACs are designed for single-supply operation from 2.7 V to 5.5 V, and can operate on two separate analog and digital power supplies. The devices are available in 20-pin SOIC and TSSOP packages.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 8-Channel, 12-/10-/8-Bit, 2.7-V to 5.5-V, Low Pwr DAC with Pwr Dwn datasheet (Rev. G) | 2008年 11月 14日 |
設計與開發
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ANALOG-ENGINEER-CALC — 類比工程師計算機
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (DW) | 20 | Ultra Librarian |
TSSOP (PW) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。