The TLV5630, TLV5631, and TLV5632 are pin-compatible,
eight-channel, 12-/10-/8-bit voltage output DACs each with a flexible serial
interface. The serial interface allows glueless interface to TMS320 and SPI,
QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string
containing 4 control and 12 data bits.
Additional features are a power-down mode, an
LDAC input for simultaneous update of all
eight DAC outputs, and a data output which can be used to cascade multiple
devices, and an internal programmable band-gap reference.
The resistor string output voltage is buffered by a
rail-to-rail output amplifier with a programmable settling time to allow the
designer to optimize speed vs power dissipation. The buffered, high-impedance
reference input can be connected to the supply voltage.
Implemented with a CMOS process, the DACs are designed for
single-supply operation from 2.7 V to 5.5 V, and can operate on two separate analog and digital power supplies. The devices are available in
20-pin SOIC and TSSOP packages.
The TLV5630, TLV5631, and TLV5632 are pin-compatible,
eight-channel, 12-/10-/8-bit voltage output DACs each with a flexible serial
interface. The serial interface allows glueless interface to TMS320 and SPI,
QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string
containing 4 control and 12 data bits.
Additional features are a power-down mode, an
LDAC input for simultaneous update of all
eight DAC outputs, and a data output which can be used to cascade multiple
devices, and an internal programmable band-gap reference.
The resistor string output voltage is buffered by a
rail-to-rail output amplifier with a programmable settling time to allow the
designer to optimize speed vs power dissipation. The buffered, high-impedance
reference input can be connected to the supply voltage.
Implemented with a CMOS process, the DACs are designed for
single-supply operation from 2.7 V to 5.5 V, and can operate on two separate analog and digital power supplies. The devices are available in
20-pin SOIC and TSSOP packages.