INA231
- Bus voltage sensing from 0 V to 28 V
- High- or low-side sensing
- Current, voltage, and power reporting
- High accuracy:
- Gain error: 0.5% (maximum)
- Offset: 50 µV (maximum)
- Configurable averaging options
- Programmable alert threshold
- 1.8-V I2C compliant
- Power-supply operation: 2.7 V to 5.5 V
- Start-up mode options:
- INA231A: active conversion
- INA231B: low-current power down
The INA231 is a current-shunt and power monitor with a 1.8-V compliant I2C interface that features 16 programmable addresses. The INA231 monitors both shunt voltage drops and bus supply voltage, providing increased protection by asserting the ALERT pin if the values are outside the programmed range. Programmable calibration value, conversion time, and averaging, combined with an internal multiplier, enable direct readouts of current in amperes and power in watts, thus reducing host processing.
The INA231 senses current on bus voltages that vary from 0 V to 28 V, with the device powered from a single 2.7-V to 5.5-V supply, drawing 330 µA (typical) of supply current. The INA231 is specified over the operating temperature range of –40°C to +125°C.
The INA231 is available in two versions: the INA231A starts up performing continuous conversions of the shunt and bus voltage, whereas the INA231B starts up in low-current, power-down mode.
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支援產品和硬體
產品
精密度運算放大器 (Vos<1mV)
一般用途運算放大器
音訊運算放大器
轉阻放大器
高速運算放大器 (GBW ≥ 50 MHz)
功率運算放大器
視訊放大器
線路驅動器
轉導放大器與雷射驅動器
全差分放大器
精確 ADC
生物感測 AFE
高速 ADC (≥10 MSPS)
觸控式螢幕控制器
差分放大器
儀器放大器
音訊線路接收器
類比電流感測放大器
數位電源監測器
配備整合式分流電阻器的類比電流感測放大器
具整合式分流電阻器的數位電源監測器
晶粒與晶圓服務
RF 接收器
RF 發射器
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數位電源監測器
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支援產品和硬體
產品
數位電源監測器
具整合式分流電阻器的數位電源監測器
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TIDA-010269 — Handheld ultrasound imaging device power supply reference design
TIDA-010057 — 超音波智慧探測器電源供應參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YFD) | 12 | Ultra Librarian |
DSBGA (YFF) | 12 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點