SLUA271C June 2002 – December 2023 ADS1013 , ADS1014 , ADS1015 , ADS1018 , ADS1112 , ADS1113 , ADS1114 , ADS1115 , ADS1118 , ADS1120 , ADS1148 , ADS114S06 , ADS114S06B , ADS114S08 , ADS114S08B , ADS1158 , ADS1191 , ADS1192 , ADS1203 , ADS1204 , ADS1205 , ADS1220 , ADS1225 , ADS1226 , ADS124S06 , ADS124S08 , ADS1257 , ADS1258 , ADS1261 , ADS1283 , ADS1287 , ADS1287D , ADS1291 , ADS1292 , ADS1292R , ADS1293 , ADS6222 , ADS6224 , ADS6242 , ADS6243 , ADS6244 , ADS6245 , ADS6422 , ADS6423 , ADS6424 , ADS6425 , ADS6442 , ADS6443 , ADS6444 , BQ24010 , BQ24012 , BQ24013 , BQ24020 , BQ24022 , BQ24023 , CC2560 , CC2564C , CSD13202Q2 , CSD15571Q2 , CSD16301Q2 , CSD16321Q5 , CSD16322Q5 , CSD16323Q3 , CSD16325Q5 , CSD16327Q3 , CSD16340Q3 , CSD16342Q5A , CSD16401Q5 , CSD16403Q5A , CSD16404Q5A , CSD16406Q3 , CSD16407Q5 , CSD16408Q5 , CSD16409Q3 , CSD16410Q5A , CSD16411Q3 , CSD16412Q5A , CSD16413Q5A , CSD16414Q5 , CSD16415Q5 , CSD16556Q5B , CSD16570Q5B , CSD17301Q5A , CSD17302Q5A , CSD17303Q5 , CSD17304Q3 , CSD17305Q5A , CSD17306Q5A , CSD17307Q5A , CSD17308Q3 , CSD17309Q3 , CSD17310Q5A , CSD17311Q5 , CSD17312Q5 , CSD17313Q2 , CSD17318Q2 , CSD17322Q5A , CSD17327Q5A , CSD17501Q5A , CSD17505Q5A , CSD17506Q5A , CSD17507Q5A , CSD17510Q5A , CSD17522Q5A , CSD17527Q5A , CSD17551Q3A , CSD17551Q5A , CSD17552Q3A , CSD17552Q5A , CSD17553Q5A , CSD17555Q5A , CSD17556Q5B , CSD17559Q5 , CSD17570Q5B , CSD17571Q2 , CSD17573Q5B , CSD17575Q3 , CSD17576Q5B , CSD17577Q3A , CSD17577Q5A , CSD17578Q3A , CSD17578Q5A , CSD17579Q3A , CSD17579Q5A , CSD17581Q3A , CSD17581Q5A , CSD18501Q5A , CSD18502Q5B , CSD18503Q5A , CSD18504Q5A , CSD18509Q5B , CSD18510Q5B , CSD18511Q5A , CSD18512Q5B , CSD18513Q5A , CSD18514Q5A , CSD18531Q5A , CSD18532NQ5B , CSD18532Q5B , CSD18533Q5A , CSD18534Q5A , CSD18537NQ5A , CSD18540Q5B , CSD18543Q3A , CSD18563Q5A , CSD19502Q5B , CSD19531Q5A , CSD19532Q5B , CSD19533Q5A , CSD19534Q5A , CSD19537Q3 , CSD19538Q2 , CSD19538Q3A , CSD25310Q2 , CSD25402Q3A , CSD25404Q3 , CSD85301Q2 , CSD85312Q3E , CSD86330Q3D , CSD86336Q3D , CSD86350Q5D , CSD86356Q5D , CSD86360Q5D , CSD87312Q3E , CSD87313DMS , CSD87330Q3D , CSD87331Q3D , CSD87333Q3D , CSD87334Q3D , CSD87335Q3D , CSD87350Q5D , CSD87351Q5D , CSD87351ZQ5D , CSD87352Q5D , CSD87353Q5D , CSD87355Q5D , CSD87502Q2 , CSD87503Q3E , CSD88584Q5DC , CSD88599Q5DC , DAC3482 , DAC3484 , LMR10510 , LMR10515 , LMR10520 , LMR10530 , MSC1202Y2 , MSC1202Y3 , MSP430F1122 , MSP430F1132 , MSP430F122 , MSP430F1222 , MSP430F123 , MSP430F1232 , MSP430F2001 , MSP430F2002 , MSP430F2003 , MSP430F2011 , MSP430F2012 , MSP430F2013 , MSP430F2013-EP , MSP430F2112 , MSP430F2122 , MSP430F2132 , MSP430FR5969 , MSP430G2001 , MSP430G2101 , MSP430G2102 , MSP430G2111 , MSP430G2112 , MSP430G2121 , MSP430G2131 , MSP430G2132 , MSP430G2152 , MSP430G2201 , MSP430G2201-Q1 , MSP430G2211 , MSP430G2212 , MSP430G2221 , MSP430G2231 , MSP430G2231-Q1 , MSP430G2232 , MSP430G2252 , MSP430G2302 , MSP430G2312 , MSP430G2332 , MSP430G2352 , MSP430G2402 , MSP430G2432 , MSP430G2452 , TLA2021 , TLA2022 , TLA2024 , TLV62065 , TLV62080 , TLV62085 , TLV62090 , TLV62130 , TLV62130A , TLV62150 , TLV62150A , TPS60150 , TPS60151 , TPS61020 , TPS61021A , TPS61024 , TPS61025 , TPS61026 , TPS61027 , TPS61028 , TPS61029 , TPS61029-Q1 , TPS61030 , TPS61031 , TPS61032 , TPS61042 , TPS61045 , TPS61086 , TPS61087 , TPS61087-Q1 , TPS61088 , TPS61089 , TPS61090 , TPS61091 , TPS61092 , TPS61093 , TPS61093-Q1 , TPS61100 , TPS61107 , TPS61120 , TPS61130 , TPS61170 , TPS61170-Q1 , TPS61200 , TPS61201 , TPS61202 , TPS61240 , TPS61240-Q1 , TPS61251 , TPS61252 , TPS61260 , TPS61261 , TPS61291 , TPS62020 , TPS62021 , TPS62026 , TPS62040 , TPS62042 , TPS62043 , TPS62044 , TPS62046 , TPS62060 , TPS62061 , TPS62063 , TPS62065 , TPS62067 , TPS62080 , TPS62080A , TPS62081 , TPS62082 , TPS62085 , TPS62086 , TPS62087 , TPS62090 , TPS62090-Q1 , TPS62091 , TPS62092 , TPS62093 , TPS62095 , TPS62097 , TPS62097-Q1 , TPS62110 , TPS62110-EP , TPS62110-Q1 , TPS62111 , TPS62111-EP , TPS62112 , TPS62112-EP , TPS62113 , TPS62122 , TPS62125 , TPS62130 , TPS62130A , TPS62131 , TPS62132 , TPS62133 , TPS62134A , TPS62134B , TPS62134C , TPS62134D , TPS62135 , TPS62136 , TPS62140 , TPS62141 , TPS62142 , TPS62143 , TPS62150 , TPS62150A , TPS62151 , TPS62152 , TPS62153 , TPS62160 , TPS62161 , TPS62162 , TPS62163 , TPS62170 , TPS62171 , TPS62172 , TPS62173 , TPS62175 , TPS62177 , TPS62230 , TPS62231-Q1 , TPS622314-Q1 , TPS62240 , TPS62242 , TPS62243 , TPS62250 , TPS62260 , TPS62260-Q1 , TPS62261 , TPS62261-Q1 , TPS62262 , TPS62262-Q1 , TPS62263 , TPS62263-Q1 , TPS62270 , TPS62272 , TPS62273 , TPS62290 , TPS62290-Q1 , TPS62291 , TPS62293 , TPS62293-Q1 , TPS62300 , TPS62301 , TPS62302 , TPS62303 , TPS62304 , TPS62305 , TPS62320 , TPS62321 , TPS62352 , TPS62355 , TPS62400 , TPS62400-Q1 , TPS62401 , TPS62402 , TPS62403 , TPS62404 , TPS62404-Q1 , TPS62406-Q1 , TPS62407-Q1 , TPS62410 , TPS62410-Q1 , TPS62420 , TPS62420-Q1 , TPS62421 , TPS62422-Q1 , TPS62423-Q1 , TPS62424-Q1 , TPS62510 , TPS62560 , TPS62562 , TPS62590 , TPS62590-Q1 , TPS62730 , TPS62732 , TPS62733 , TPS62740 , TPS62750 , TPS62751 , TPS62821 , TPS62822 , TPS62823 , TPS62825 , TPS62826 , TPS62840 , TPS62870 , TPS62870-Q1 , TPS62871 , TPS62871-Q1 , TPS62872 , TPS62872-Q1 , TPS62873 , TPS62873-Q1 , TPS62874-Q1 , TPS62875-Q1 , TPS62876-Q1 , TPS62877-Q1 , TPS63000 , TPS63000-Q1 , TPS63001 , TPS63002 , TPS63020 , TPS63021 , TPS63030 , TPS63031 , TPS63050 , TPS63051 , TPS63060 , TPS63061 , TPS63070 , TPS63700 , TPS63710 , TPS84620 , TPSM82810 , TPSM82813 , TPSM82816 , TPSM82821 , TPSM82822 , TPSM82864A , TPSM82866A , TPSM82866C , TPSM8287A06 , TPSM8287A10 , TPSM8287A12 , TPSM8287A15 , TUSB7320 , TUSB7340 , TUSB8040A , TUSB8040A1
- 1
- QFN and SON PCB Attachment
- Trademarks
- 1Texas Instruments Quad Flatpack No Leads and Small-Outline No Leads
- 2Manufacturing Considerations
- 3Printed Circuit Board (PCB) Design Guidelines
- 4Solder Paste Screen Printing Process
- 5Package to Board Assembly Process
- 6Rework Guidelines (Hot Gas Convection and Manual)
- 7Revision History
4.3 Lead Finger Stencil Design
The stencil aperture is typically designed to match the PCB or substrate pad size 1:1 (1:1 is recommended on periphery lead fingers and not the center thermal pad – see Section 4.4 for exposed pad recommendations). For fine-pitch QFN and SON components of 0,5 mm and below, it can be necessary to reduce the stencil aperture by 20% to prevent shorting beneath the QFN, paying special attention that the area or aspect ratios are not exceeded. This reduction is recommended in cases where the SMT equipment placement force is not well regulated, leading to shorting from excessive solder-paste squeeze out. For 0,4-mm pitch components, a pad width of 0,2 mm is recommended to aid solder-paste printing and to achieve a gap of 0,2 mm between pads.
Lead finger stencil dimensions depend on the specific QFN and SON lead finger dimensions. For example, on a 0,5-mm pitch device with 0,85-mm x 0,28-mm wide pads, a stencil aperture of 0,23 mm x 0,8 mm and thickness of 0,125 mm should be used to achieve adequate print volume and area ratio requirements as outlined in IPC-7525 (see Figure 4-2). In cases where the board land pattern must be minimized, the stencil aspect and area ratios should be considered before board design.
The area ratio of the stencil is critical for the printing to get good paste release. For very small apertures where the area ratio is less than 0.66, the stencil must be nickel formed. This type of stencil has superior release characteristics over stencils that have been produced by laser. Experiments have shown that nickel-formed stencils print with area ratios down to 0.57. Check with your stencil supplier for recommendations when designing an aperture with a challenging area ratio.
The aspect ratio relates to the manufacture of stencils. Stencil manufacturers require the aspect ratios (see Figure 4-2) to be greater than 1.5 (see IPC-7525).
The higher the area ratio, the better the solder paste releases, in addition to depositing more volume. Stencil thickness is inversely proportional to the area ratio. So the thinner the stencil, the higher the area ratio will be, ultimately resulting in a robust solder-paste release (see IPC-7525).
Figure 4-2 Aspect and Area Ratio Illustration